Exhibition

Outline

RadTech Asia 2009 Exhibition

November 25–27, 2009

 

November 25 (Wed.)
November 26 (Thu.)
November 27 (Fri.)

9:00 - 17:00
9:00 - 17:00
9:00 - 15:00

Organized by: RadTech Asia 2009 Organizing Committee
Sponsored by: RadTech Japan

Venue: 3F, Conference Center, Pacifico Yokohama
1-1-1, Minatomirai, Nishi-ku, Yokohama 220-0012, Japan

 

Privileges for exhibitors

The exhibitors are provided with:

1. One free ticket for the Buffet Dinner on November 26, 2009
2. One free Conference Proceedings

 

 

Exhibition Fee and Conditions

Exhibition Fee *Tax included

1 booth                   250,000 JPY
2 booths or more    200,000 JPY / per booth

 

Package Booth (Shell scheme booth)

Width 1.98m x Depth 1.98m x Height 2.4m

Wall: System panel (Color: white)
Fascia board with company name
Reception counter
Folding chair
Fluorescent light
Basic electrical power supply
          with outlet (100V/ 1kW)

*Even if an exhibitor does not use the package booth, the exhibition fee will not be discounted.

 

Applications

To apply, please kindly fill in the application form and send it to the Secretariat by fax.
The invoice will be sent after the application is accepted by the Organizer.

 

Exhibitors are to make payment by the date as stipulated on the invoice.
Payment is to be made by bank transfer, in Japanese yen with the transfer charges being paid by the exhibitor.

 

Terms and Conditions

Application Form

 

Deadline: June 30 (Tue.), 2009

We will close applications before this deadline if all booths become fully booked.

 

Cancellation Policy

Cancellation notice received by August 31 (Mon.), 2009: 50% of the exhibition fee
Cancellation notice received on or after September 1 (Tue.), 2009: 00% of the exhibition fee

 

*An exhibitor that has not remitted the invoiced amount at the time of cancellation must still pay the due cancellation charge.
If the payment already made by the exhibitor exceeds the due cancellation charge, the difference will be refunded.

 

Booth Allotment

Booths will be allocated on a first-come first-served basis. If the booth of your preference is not available,
the Secretariat will inform you of the available booth number.

 

Floor Plan

 

 

Schedule *Tentative

June 30, 2009 Deadline for applications
September Distribution of Exhibitor’s manual
November 24 Move-in 12:00–
November 25, 26 Exhibition 09:00–17:00
November 27 Exhibition 09:00–15:00
November 27 Move-out 15:00–

 

 

Inquiries:

RadTech Asia 2009 Exhibition Secretariat
c/o ICS Convention Design, Inc.
E-mail: rad09ex@ics-inc.co.jp
Phone: +81-3-3219-3541       Fax: +81-3-3219-3626
3-24, Kanda-Nishikicho, Chiyoda-ku, Tokyo 101-8449, Japan

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